苹果 2026-2028 MacBook 路线图曝光：OLED 触控 Ultra、M6/M7 芯片与以 AI 为核心的重新设计
英文摘要
Apple plans to launch a new MacBook Ultra with OLED touchscreen (14-inch K114, 16-inch K116) in late 2026, using M5 Pro/Max chips and a Dynamic Island-style punch-hole instead of a notch. A M6-based MacBook Pro will arrive simultaneously with the old design, featuring a 2nm process, 200GB/s memory bandwidth, and a 12-core GPU, but no M6 Pro/Ultra variants. By mid-2027, an entry-level MacBook Pro with a new design and M7 chip (240GB/s memory bandwidth) will appear, followed by M7 Pro/Max/Ultra by 2028, heavily optimized for on-device AI. The M5 Ultra (36 CPU, 80 GPU, up to 768GB memory) will power a new Mac Studio in late 2026. Apple may fast-track M7 due to 2nm capacity constraints and possibly use Intel's 18A process for some chips, while doubling down on local AI compute to reduce cloud costs and improve user experience.
中文摘要
苹果计划在2026年底推出全新 MacBook Ultra，配备 OLED 触控屏（14 英寸代号 K114，16 英寸 K116），使用 M5 Pro/Max 芯片，并改用类似灵动岛的挖孔屏取代刘海。同时发布的还有沿用旧模具的 M6 MacBook Pro，搭载 2nm 制程的 M6 芯片，内存带宽提升至 200GB/s，配备 12 核 GPU，但不会推出 M6 Pro/Ultra 版本。2027 年中起，采用全新设计的入门款 MacBook Pro 将搭载 M7 芯片（内存带宽约 240GB/s），后续推出 M7 Pro/Max/Ultra，重点优化端侧 AI 性能。M5 Ultra（36 核 CPU、80 核 GPU、最高 768GB 内存）将用于 2026 年底的新 Mac Studio。受 2nm 产能限制，苹果可能快速过渡到 M7，并可能利用英特尔 18A 工艺生产部分芯片，同时全力增强本地 AI 算力以节省成本和提升体验。
关键要点
First Apple OLED touchscreen laptop (MacBook Ultra) in late 2026 with M5 Pro/Max, 14/16-inch, punch-hole design.
首款 OLED 触控 MacBook Ultra 将于 2026 年底发布，搭载 M5 Pro/Max，采用 14/16 英寸挖孔屏设计。
M6 (2nm) arrives with 200GB/s bandwidth, 12-core GPU, but only as a base chip in old-body MacBook Pro alongside the new Ultra.
M6 芯片采用 2nm 工艺，内存带宽 200GB/s，12 核 GPU，但仅作为基础款出现在沿用旧模具的 MacBook Pro 中。
M7 family (2027) focuses on on-device AI with ~240GB/s bandwidth; new entry-level MacBook Pro with redesigned body arrives first.
M7 系列（2027年）主打端侧 AI，内存带宽约 240GB/s；全新设计的入门款 MacBook Pro 率先推出。
M5 Ultra in Mac Studio (late 2026): 36 CPU, 80 GPU, up to 768GB memory, possibly testing top-tier performance.
M5 Ultra 将于 2026 年底用于新 Mac Studio，配备 36 核 CPU、80 核 GPU，最高支持 768GB 内存。
Apple may skip high-end M6 variants due to 2nm capacity, push to M7 quickly, and consider Intel 18A for some production.
因 2nm 产能限制，苹果可能跳过 M6 高端型号，快速推进 M7，并考虑采用英特尔 18A 工艺生产部分芯片。